Description: Polysynthetic gold thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.Weight: 1.0g/tubeOperation Temperature: -50/180°cThermal Conductivity: >3.05W/m.k, Thermal Resistance: 20% metal oxide compounds Orders under $10 ship without tracking If you need tracking on orders under $10 then pay the extra $1.99 for package service Freight Forwarders and US Territories (except PR): Orders under $10 will be canceled unless the $1.99 shipping option is selected at checkout
Price: 3.99 USD
Location: Indianapolis, Indiana
End Time: 2024-02-21T21:53:46.000Z
Shipping Cost: 0 USD
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Item Specifics
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Return policy details:
Brand: Unbranded
MPN: Does Not Apply
Type: Thermal Compound
Packaging: Blister Pack
Country/Region of Manufacture: China
