Description: RL-400/401/402/403 medium temperature solder paste 183℃ no-clean mobile phone repair solder paste welding tin mud1.Paste delicate，Lasting shine，The particle size is only 20-38 micron.RELIFE No. 4 solder matarialFine particles, evenly distributed2.The paste is delicate, moderately moist, and the yield rate of tin implantation is high.Continuous tin planting takes a long time,There is basically no collapse after several hours of tin implantation.The viscosity change is small and chip components are not prone to offset.3.Moderate viscosity, no slumping or deflectionRELIFE solder paste has moderate humidity and is not easy to clump.Easy to tin, no false soldering3.Craftsmanship and qualityThe solder joints are bright and fullNo false welding, less residue, bright solder jointsStrong tin creep, good conductivity, oxidation resistance, no corrosion to PCB, no cleaning required4.Applicable: PCB welding of dense pin IC and various high-demand materialsFeatures: Strong solder penetration, smooth and bright solder joints5.Suitable for sensors, wires, motors, fuses, connectors, metal shells, lightingElectronic components, SMT repair, BGA chip tin implantation, SMT patches, etc.
Price: 5.99 USD
Location: Xi'an,Shaanxi
End Time: 2024-11-16T02:58:26.000Z
Shipping Cost: 0 USD
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Item Specifics
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Brand: RELIFE
Compatible Brand: Universal
Type: RL-400
Compatible Model: Universal
Available Variations
Color: RL-400
Price: 5.99 USD
Available Quantity: 25
Quantity Sold: 0
Color: RL-401
Price: 6.99 USD
Available Quantity: 25
Quantity Sold: 0
Color: RL-402
Price: 7.5 USD
Available Quantity: 27
Quantity Sold: 3
Color: RL-403
Price: 7.3 USD
Available Quantity: 35
Quantity Sold: 10
